Wafer cleaning is a crucial, repetitive step in semiconductor manufacturing. It impacts product yield and reliability by effectively removing unwanted microscopic materials, including chemical residues similar to the device films.

PTW SpinTec’s single-wafer spin technology offers the required process flexibility and high productivity to handle a broad spectrum of wafer cleaning steps throughout the entire manufacturing process flow effectively.

SpinTec Wafertechnology


  • Substrate Etch
  • Film Etch
  • Metal Etch
  • Surface Clean
  • Bevel Etch & Clean
  • Backside Film removal

Key Applications

  • Particle, polymer, and residue removal
  • Backside/bevel cleaning
  • Silicon substrate thinning/stress relief