Wafer cleaning is a crucial, repetitive step in semiconductor manufacturing. It impacts product yield and reliability by effectively removing unwanted microscopic materials, including chemical residues similar to the device films.
PTW SpinTec’s single-wafer spin technology offers the required process flexibility and high productivity to handle a broad spectrum of wafer cleaning steps throughout the entire manufacturing process flow effectively.
Applications
- Substrate Etch
- Film Etch
- Metal Etch
- Surface Clean
- Bevel Etch & Clean
- Backside Film removal
Key Applications
- Particle, polymer, and residue removal
- Backside/bevel cleaning
- Silicon substrate thinning/stress relief